Rumah ProdukBreadboard Lingkar Lubang

1100 Points Round Hole Breadboard Solderless For School student Experiment

Sertifikasi
Cina CIXI ZHONGYI ELECTRONIC EQUIPMENT FACTORY Sertifikasi
Ulasan pelanggan
you product is very nice.

—— Kevin

thanks for your service. I receive the goods in good condition.

—— Alice

I 'm Online Chat Now

1100 Points Round Hole Breadboard Solderless For School student Experiment

1100 Points Round Hole Breadboard Solderless For School student Experiment
1100 Points Round Hole Breadboard Solderless For School student Experiment

Gambar besar :  1100 Points Round Hole Breadboard Solderless For School student Experiment

Detail produk:
Place of Origin: Zhejiang, China (Mainland)
Nama merek: ZHONGYI
Sertifikasi: ROHS
Model Number: ZY-16003
Syarat-syarat pembayaran & pengiriman:
Minimum Order Quantity: 1 Piece
Harga: please contact me
Packaging Details: 50 pcs packed into a carton
Delivery Time: 0-3 days after payment
Payment Terms: paypal, WU, T/T
Supply Ability: 1000 Piece/Pieces per Day

1100 Points Round Hole Breadboard Solderless For School student Experiment

Deskripsi
3Terminal Strip: Titik seri 900 4 Strip Distribusi: Titik dasi 200
Bahan kontak: klip pegas Bahan: ABS
Ukuran Papan (cm): 14.5 * 8.2 * 0.85 Pelat Logam (cm): 17,5 * 14 * 0,12
Lubang: Bulat Min. Jarak Garis: Pitch = 2.54mm / 0.1 ''
Cahaya Tinggi:

soldered breadboard

,

solderless board

1100 Points Round Hole Solderless Breadboard can be used many times

 

 

Features: 

  • 3 Terminal strips: 900 tie points
  • 4  Distribution strips: 200 tie points
  • 3 Binding Posts
  • Accepts a variety of wire sizes (20-29 AWG)     
  • Housing Material: ABS
  • Hole: Round

 

 

Specifications:

 

Accepts transistors, diodes, LEDS, resistors, capacitors and virtually all types of components 

An invaluable tool for the most demanding prototyping and design applications in the R&D or university lab.

 

Item Number ZY-16003
3Terminal Strips Tie-point 900
2 Distribution Strips Tie-point 200
Product Size 14.5*8.2*0.85(cm)
Metal Plate 17.5*14*0.12(cm)
Package Blister Card

 

 

Product Details:

  • Twin adhesive back, could be fix and remove to any position easily
  • Coloured coordinates for easy component placement
  • Protection: Short circuit / Overload / Over voltage
  • Cooling by free air convection
  • All material Rohs compliance
  • Low cost, high reliability & fast delivery

 

Product Image:

1100 Points Round Hole Breadboard Solderless For School student Experiment 0

Rincian kontak
CIXI ZHONGYI ELECTRONIC EQUIPMENT FACTORY

Kontak Person: PAN

Mengirimkan permintaan Anda secara langsung kepada kami (0 / 3000)